The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Jun. 11, 2007
Michael Joseph Zipparo, Parker, CO (US);
Monica Page Johnson, Greenwood Village, CO (US);
Clyde Gerald Oakley, Centennial, CO (US);
Dennis Raymond Dietz, Littleton, CO (US);
Michael Robert Labree, Centennial, CO (US);
Mark Nathaniel Donhowe, Newark, DE (US);
Michael Joseph Zipparo, Parker, CO (US);
Monica Page Johnson, Greenwood Village, CO (US);
Clyde Gerald Oakley, Centennial, CO (US);
Dennis Raymond Dietz, Littleton, CO (US);
Michael Robert LaBree, Centennial, CO (US);
Mark Nathaniel Donhowe, Newark, DE (US);
Gore Enterprise Holdings, Inc., Newark, DE (US);
Abstract
An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.