The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Apr. 27, 2006
Naoki Idani, Kawasaki, JP;
Naoki Idani, Kawasaki, JP;
Fujitsu Semiconductor Limited, Yokohama, JP;
Abstract
A wafer on which a CMP processing is completed is rotated. A front surface cleaning brush and a rear surface cleaning brush are made contact both surfaces of the wafer while being rotated. After the front surface cleaning brush and the rear surface cleaning brush are made to contact the wafer, both end portions of the front surface cleaning brush and the rear surface cleaning brush are deformed by means of pressurizing both ends of the front surface cleaning brush and the rear surface cleaning brush by pressure portions. That is, the both end portions of the front surface cleaning brush and the rear surface cleaning brush are compressed to enlarge diameters in the both end portions. As a consequence, the entire front surface of the wafer is made to contact the front surface cleaning brush substantially evenly, even if the wafer is warped into a shape of a mound. Therefore, a cleaning efficiency of the outer peripheral portion of the wafer improves.