The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2011

Filed:

Mar. 28, 2008
Applicants:

Kazumasa Seki, Kyoto, JP;

Akihiko Hatamura, Kyoto, JP;

Hitoshi Yoshida, Kyoto, JP;

Toshio Yamashita, Kyoto, JP;

Inventors:

Kazumasa Seki, Kyoto, JP;

Akihiko Hatamura, Kyoto, JP;

Hitoshi Yoshida, Kyoto, JP;

Toshio Yamashita, Kyoto, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides an electrocasting method by which the shape of the surface opposite to the surface to be electrodeposited on the mold can be controlled. A molded metal article is electrocast by forming an insulating layer on the side wall faces of a cavity and the outer wall face of a conductive mold in which the cavity is formed, placing the mold in an electrolysis tank and applying voltage, electrodepositing metal on the bottom face of the cavity, and growing the metal layer in the cavity so as to leave a space having a height of at least one-third the width of the cavity.


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