The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2011

Filed:

Dec. 04, 2008
Applicants:

Karl Brown, Mountain View, CA (US);

Semyon Sherstinsky, San Francisco, CA (US);

Wei W. Wang, Santa Clara, CA (US);

Cheng-hsiung Tsai, Cupertino, CA (US);

Vineet Mehta, Sunnyvale, CA (US);

Allen Lau, Cupertino, CA (US);

Steve Sansoni, Livermore, CA (US);

Inventors:

Karl Brown, Mountain View, CA (US);

Semyon Sherstinsky, San Francisco, CA (US);

Wei W. Wang, Santa Clara, CA (US);

Cheng-Hsiung Tsai, Cupertino, CA (US);

Vineet Mehta, Sunnyvale, CA (US);

Allen Lau, Cupertino, CA (US);

Steve Sansoni, Livermore, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
Abstract

A substrate support has an electrostatic chuck comprising an electrostatic puck with a dielectric covering an electrode capable of being charged to energize a process gas. The chuck has a frontside surface to receive a substrate and a base plate having an annular flange. A spring loaded heat transfer plate contacts the base plate, and has a fluid channel comprising first and second spiral channels. A pedestal is below the heat transfer plate.


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