The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Oct. 14, 2008
Yuichi Miyagawa, Kanagawa, JP;
Yuichi Miyagawa, Kanagawa, JP;
Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;
Abstract
A semiconductor device includes a semiconductor chip, a supporting body that is disposed below the semiconductor chip and supports the semiconductor chip, a spacer that is fixed onto the first semiconductor chip, and a substrate that is located below the first semiconductor chip and electrically connected to the semiconductor chip with a wire. At least a part of the peripheral portion of the semiconductor chip is an overhang portion that projects more laterally than the peripheral portion of the supporting body. A covering portion that covers a part of the upper surface of the overhang portion is formed in the spacer. The wire is connected to a region in the upper surface of the overhang portion, the region being lateral to the outermost periphery of the covering portion of the spacer and not being covered with the covering portion of the spacer. A height of an apex of the wire from the upper surface of the first semiconductor chip as a reference, is greater than a height, from the reference, of at least a portion in the outermost periphery of the covering portion of the spacer, the portion having the wire arranged at its lateral side.