The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
May. 31, 2006
Applicants:
Shigeki Hoshino, Minato-ku, JP;
Michinobu Tanioka, Minato-ku, JP;
Toru Taura, Minato-ku, JP;
Inventors:
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A plurality of LSI chips () are stacked on an interposer (). Signal coils () for signal transmission are formed on the circuit formation surfaces of LSI chips () that are formed using silicon substrates (). The signal coils () connect to circuits formed in the LAI chips (). Through-holes () are formed in the centers of the signal coils () of the silicon substrate (). Signal coils () connected to solder balls () by way of through-conductors () are formed on the interposer (). Magnetic pins () that are composed of a magnetic material are inserted in the centers of the signal coils (and).