The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Mar. 23, 2005
Meike Niesten, Köln, DE;
Christoph Irle, Barcelona, ES;
Federico Comajuan, Teia, ES;
Maria Almató Guiteras, Barcelona, ES;
Amadeo Vicente, Barcelona, ES;
Meike Niesten, Köln, DE;
Christoph Irle, Barcelona, ES;
Federico Comajuan, Teia, ES;
Maria Almató Guiteras, Barcelona, ES;
Amadeo Vicente, Barcelona, ES;
Bayer MaterialScience AG, Leverkusen, DE;
Abstract
Solvent-containing formulations including NCO-containing prepolymers based on TDI isocyanurate polyisocyanates and diphenylmethane diisocyanates where some prepolymers are prepared using a polyetherdiol containing ethylene oxide blocks and having an ethylene oxide content of from 2 to 18% by weight, based on all the alkylene oxide units. The formulation have an NCO content of 1% to 7% by weight, a solids content of 20% to 70% by weight, a monomeric TDI content of less than 0.2% by weight and a monomeric methylenediphenyl diisocyanate content of less than 2% by weight. The solvent-containing formulations can be prepared in organic solvents by reacting at least one of A) a TDI component comprising TDI isocyanurate polyisocyanates and B) an MDI component comprising diphenylmethane diisocyanates with C) a polyetherdiol. The solvent-containing formulations can be used in moisture-curing coating compositions, adhesive bonds and/or seals with substrates.