The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Nov. 28, 2007
Takaaki Morita, Tokyo, JP;
Takaaki Morita, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
There is disclosed a fixing method of an electronic component or the like in which when the electronic component and a resin layer are fixed, warp and bend of the electronic component can be inhibited. During manufacturing of a semiconductor-embedded substratein which a semiconductor deviceis embedded, after the semiconductor deviceis disposed on an unhardened resin layer, this device is stored in a containerof a pressurizing and heating unit, and the semiconductor deviceis isotropically pressurized using an internal gas in the containeras a pressure medium, whereby the semiconductor deviceis pressed to the unhardened resin layer, and the resin layeris heated to harden. In consequence, the semiconductor deviceis fixed and mounted on the resin layerwithout being warped or bent.