The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2011
Filed:
Jun. 29, 2005
Guy Feuillet, Saint Martin d'uriage, FR;
Hubert Moriceau, Saint Egreve, FR;
Stephane Pocas, Grenoble, FR;
Eric Jalaguier, Saint Martin d'Uriage, FR;
Norbert Moussy, Saint Agnes, FR;
Guy Feuillet, Saint Martin d'uriage, FR;
Hubert Moriceau, Saint Egreve, FR;
Stephane Pocas, Grenoble, FR;
Eric Jalaguier, Saint Martin d'Uriage, FR;
Norbert Moussy, Saint Agnes, FR;
Commissariat a l'Energie Atomique, Paris, FR;
Abstract
An assembly method to enable local electrical bonds between zones located on a face of a first substrate and corresponding zones located on a face of a second substrate, the faces being located facing each other, at least one of the substrates having a surface topography. The method forms an intermediate layer including at least one burial layer on the face of the substrate or substrates having a surface topography to make it (them) compatible with molecular bonding of the faces of substrates to each other from a topographic point of view, resistivity and/or thickness of the intermediate layer being chosen to enable the local electrical bonds, brings the two faces into contact, the substrates positioned to create electrical bonds between areas on the first substrate and corresponding areas on the second substrate, and bonds the faces by molecular bonding.