The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7903831 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 08, 2011

Filed:

Aug. 18, 2006
Applicant:

Chung Dam Song, Seoul, KR;

Inventor:

Chung Dam Song, Seoul, KR;

Assignee:

BSE Co., Ltd., Namdong-gu, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed are a silicon based condenser microphone and a packaging method for the silicon based condenser microphone. The silicon based condenser microphone comprises a metal case, and a board which is mounted with a MEMS microphone chip and an ASIC chip having an electric voltage pump and a buffer IC and is formed with a connecting pattern for bonding with the metal case, wherein the connecting pattern is welded to the metal case. The method for packaging a silicon based condenser microphone includes the steps of inputting a board which is mounted with a MEMS chip and an ASIC chip and is formed with a connecting pattern; inputting a metal case, aligning the metal case on the connecting pattern of the board, and welding an opened end of the metal case to the connecting pattern of the board. Thus, the metal case is welded to the board by the laser.


Find Patent Forward Citations

Song, Chung. (2011). Silicon based condenser microphone and packaging method for the same (U.S. Patent No. 7903831). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7903831

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