The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Jan. 30, 2008
Suk-hyeon Cho, Suwon-si, KR;
Je-gwang Yoo, Yongin-si, KR;
Min-sang Lee, Suwon-si, KR;
Seon-goo Lee, Gunpo-si, KR;
Han-seo Cho, Daejeon, KR;
Suk-Hyeon Cho, Suwon-si, KR;
Je-Gwang Yoo, Yongin-si, KR;
Min-Sang Lee, Suwon-si, KR;
Seon-Goo Lee, Gunpo-si, KR;
Han-Seo Cho, Daejeon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A package board and a method for the manufacturing of the package board are disclosed. A package board, which includes a first metal layer, a heat-release layer stacked on the first metal layer with a first insulation layer interposed in-between, a cavity formed in the heat-release layer, a mounting layer formed in the cavity in contact with the first insulation layer, a first component mounted on the mounting layer, and a second insulation layer covering at least a portion of the heat-release layer and the cavity, may offer improved heat release and smaller thickness.