The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Sep. 18, 2009
Arlyn Earl Miller, Leander, TX (US);
Gary Law, Georgetown, TX (US);
Kent A. Burr, Round Rock, TX (US);
Paul Noble-campbell, Austin, TX (US);
Vincent Lam, Austin, TX (US);
Laura Avery, Austin, TX (US);
Garrett Lewis, Austin, TX (US);
Kevin Sloan, Austin, TX (US);
Mark William Foohey, Austin, TX (US);
Arlyn Earl Miller, Leander, TX (US);
Gary Law, Georgetown, TX (US);
Kent A. Burr, Round Rock, TX (US);
Paul Noble-Campbell, Austin, TX (US);
Vincent Lam, Austin, TX (US);
Laura Avery, Austin, TX (US);
Garrett Lewis, Austin, TX (US);
Kevin Sloan, Austin, TX (US);
Mark William Foohey, Austin, TX (US);
Fisher-Rosemount Systems, Inc., Austin, TX (US);
Abstract
Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.