The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7902672 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 08, 2011

Filed:

Aug. 08, 2007
Applicant:

Osamu Yamagata, Kanagawa, JP;

Inventor:

Osamu Yamagata, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device in a packaged form including a semiconductor includes a semiconductor substrate with an active component disposed thereon and pads disposed on a surface thereof and connected to the active component, a first interconnection disposed on the semiconductor substrate and connected to the pads, a first insulating layer disposed on the semiconductor substrate in covering relation to the first interconnection and having an opening reaching a portion of the first interconnection, and a second interconnection disposed in the opening and on the first insulating layer and connected to the first interconnection.


Find Patent Forward Citations

Yamagata, Osamu. (2011). Semiconductor device and method of manufacturing same (U.S. Patent No. 7902672). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7902672

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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