The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Jul. 20, 2007
Applicants:
Hyo-jae Bang, Cheonan-si, KR;
Dong-chun Lee, Cheoonan-si, KR;
Seong-chan Han, Cheonan-si, KR;
Kyung-du Kim, Daejeon, KR;
Sun-kyu Hwang, Cheonan-si, KR;
Inventors:
Hyo-jae Bang, Cheonan-si, KR;
Dong-chun Lee, Cheoonan-si, KR;
Seong-chan Han, Cheonan-si, KR;
Kyung-du Kim, Daejeon, KR;
Sun-kyu Hwang, Cheonan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
Example embodiments relate to a semiconductor package. The semiconductor package may include a mounting substrate, a semiconductor chip mounted to the mounting substrate, at least one passive component passing therethrough and mounted to the mounting substrate, and a cover covering the mounting substrate, the semiconductor chip and the at least one passive component.