The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
May. 10, 2006
Lew G. Choa-eoan, Carlsbad, CA (US);
Thomas R. Toms, Dripping Springs, TX (US);
Boris Dimitrov Andreev, San Diego, CA (US);
Justin Joseph Rosen Gagne, San Diego, CA (US);
Chunlei Shi, Poway, CA (US);
Lew G. Choa-Eoan, Carlsbad, CA (US);
Thomas R. Toms, Dripping Springs, TX (US);
Boris Dimitrov Andreev, San Diego, CA (US);
Justin Joseph Rosen Gagne, San Diego, CA (US);
Chunlei Shi, Poway, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
In one particular embodiment, an integrated circuit includes a package and a substrate electrically and physically coupled to the package. The package includes a first pin, a second pin, and metallization coupling the first pin to the second pin. The substrate is coupled to the package via the first pin and the second pin. The substrate includes a plurality of power domains and a power control unit. The second pin of the package is coupled to a particular power domain of the plurality of power domains. The power control unit includes logic and a switch, where the switch includes a first terminal coupled to a voltage supply terminal, a control terminal coupled to the logic, and a second terminal coupled to the first pin of the package. The logic selectively activates the switch to distribute power to the particular power domain via the metallization of the package.