The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Jun. 25, 2007
Applicant:
Melissa Grupen-shemansky, Los Gatos, CA (US);
Inventor:
Melissa Grupen-Shemansky, Los Gatos, CA (US);
Assignee:
Spansion LLC, Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
In constructing a multi-die semiconductor device, a plurality of semiconductor die are provided. Each die is probe tested when it is part of a wafer. Flat contacts are connected to each die when it is part of a wafer. After wafer sawing, each die is tested in a test socket, using the contacts connected thereto. The die are then packaged in stacked relation to form the multi-die semiconductor device.