The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2011

Filed:

Sep. 04, 2004
Applicants:

David Christoph Müller, München, DE;

Nina Riegel, Köln, DE;

Frank Meyer, Heidelberg, DE;

René Scheurich, Groβ-Zimmern, DE;

Aurélie Falcou, Frankfurt am Main, DE;

Klaus Meerholz, Rösrath, DE;

Inventors:

David Christoph Müller, München, DE;

Nina Riegel, Köln, DE;

Frank Meyer, Heidelberg, DE;

René Scheurich, Groβ-Zimmern, DE;

Aurélie Falcou, Frankfurt am Main, DE;

Klaus Meerholz, Rösrath, DE;

Assignee:

Merck Patent GmbH, Darmstadt, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/06 (2006.01); B32B 27/26 (2006.01); B32B 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to electronic devices whose electronic properties can surprisingly be improved to a significant degree by inserting at least one crosslinkable polymeric buffer layer, preferably a cationically crosslinkable polymeric buffer layer, between the conductive doped polymer and the organic semiconductor layer. Particularly good properties are obtained with a buffer layer in which crosslinking is thermally induced, i.e. by raising the temperature to 50 to 250° C. Alternatively, crosslinking can be radiation-induced by adding a photoacid. Moreover, such a buffer layer can be advantageously applied by means of printing techniques, especially inkjet printing, as the ideal temperature for the thermal treatment is independent of the glass transition temperature of the material. This avoids having to rely on material that has a low molecular weight, making it possible to apply the layer by means of printing techniques. The next layer (the organic semiconductor layer) can also be applied with the aid of different printing techniques, particularly inkjet printing, because the buffer layer is rendered insoluble by the crosslinking process, thus preventing the buffer layer from solubilizing thereafter.


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