The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Feb. 21, 2008
Kanji Sekihara, Toyokawa, JP;
Masayoshi Uehira, Osaka, JP;
Kanji Sekihara, Toyokawa, JP;
Masayoshi Uehira, Osaka, JP;
Konica Minolta Opto, Inc., Tokyo, JP;
Abstract
Provided is a microchip manufacturing method by which a functional film is formed in a flow path channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films () representing the functional films on a surface having a flow path channel () of a microchip substrate () and on a surface having a flow path channel () of a microchip substrate () respectively; a second step of exfoliating the SiOfilms formed on the microchip substrates () except the SiOfilms formed on the flow path channels () by a cohesive member; and a third step of placing the microchip substrates () one over another in such a way that the surfaces on which the flow path channels () are formed face inside, and bonding the substrates by laser welding, ultrasonic wave welding or thermocompression bonding.