The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7901490 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 08, 2011

Filed:

Jan. 10, 2008
Applicants:

David J. Clark, Poughkeepsie, NY (US);

Alison K. Easton, New Paltz, NY (US);

James E. Fluegel, Rhinbeck, NY (US);

James H. Peterman, Milford, CT (US);

Inventors:

David J. Clark, Poughkeepsie, NY (US);

Alison K. Easton, New Paltz, NY (US);

James E. Fluegel, Rhinbeck, NY (US);

James H. Peterman, Milford, CT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system and method of reducing the introduction of foreign material to wafers. A system includes an enclosure structured and arranged to carry wafers used in semiconductor device manufacturing, and an attractive material arranged as at least a portion of an interior surface of the enclosure.


Find Patent Forward Citations

Clark, David. (2011). Reducing introduction of foreign material to wafers (U.S. Patent No. 7901490). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7901490

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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