The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2011

Filed:

Nov. 28, 2007
Applicants:

Yasuo Yamaguchi, Chiyoda-ku, JP;

Makio Horikawa, Chiyoda-ku, JP;

Mika Okumura, Chiyoda-ku, JP;

Kimitoshi Sato, Chiyoda-ku, JP;

Takeshi Murakami, Chiyoda-ku, JP;

Inventors:

Yasuo Yamaguchi, Chiyoda-ku, JP;

Makio Horikawa, Chiyoda-ku, JP;

Mika Okumura, Chiyoda-ku, JP;

Kimitoshi Sato, Chiyoda-ku, JP;

Takeshi Murakami, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
Abstract

First and second semiconductor layers are attached to each other with an insulation layer sandwiched therebetween. An acceleration sensor device is formed in the first semiconductor layer. A control device for controlling the acceleration sensor device is formed on the second semiconductor layer. Through holes are formed in the second semiconductor layer, and an insulation layer is formed to cover the wall surfaces of the through holes. Through interconnections are formed within the through holes for electrically connecting the acceleration sensor device and the control device to each other. Accordingly, it is possible to obtain an acceleration sensor having excellent detection accuracy while having a reduced size, and a fabrication method thereof.


Find Patent Forward Citations

Loading…