The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Nov. 28, 2008
Applicants:
Tatsuya Sakata, Tokyo, JP;
Toru Yamauchi, Kanagawa, JP;
Kenichi Seki, Tokyo, JP;
Terutaka Yana, Tokyo, JP;
Inventors:
Tatsuya Sakata, Tokyo, JP;
Toru Yamauchi, Kanagawa, JP;
Kenichi Seki, Tokyo, JP;
Terutaka Yana, Tokyo, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat dissipating structure for an electronic component of the present invention includes a main board on which electronic components are mounted, a heat sink disposed facing the main board and contacting a plurality of the electronic components on the main board, a heat pipe disposed on the heat sink, an arm branching from the heat sink and elastically deformable in relation to the heat sink, and a cooling fan located at the end portion of the heat pipe.