The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Nov. 23, 2009
Peter J. Hopper, San Jose, CA (US);
Peter Johnson, Sunnyvale, CA (US);
Kyuwoon Hwang, Palo Alto, CA (US);
Andrei Papou, San Jose, CA (US);
Peter J. Hopper, San Jose, CA (US);
Peter Johnson, Sunnyvale, CA (US);
Kyuwoon Hwang, Palo Alto, CA (US);
Andrei Papou, San Jose, CA (US);
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Methods for forming multiple inductors on a semiconductor wafer are described. A plating layer and a photoresist layer are applied over a semiconductor wafer. Recess regions are etched in the photoresist layer using photolithographic techniques, which exposes portions of the underlying plating layer. Metal is electroplated into the recess regions in the photoresist layer to form multiple magnetic core inductor members. A dielectric insulating layer is applied over the magnetic core inductor members. Additional plating and photoresist layers are applied over the dielectric insulating layer. Recess regions are formed in the newly applied photoresist layer. Electroplating is used to form inductor windings in the recess regions. Optionally, a magnetic paste can be applied over the inductor coils.