The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2011

Filed:

Sep. 28, 2006
Applicant:

Tsukasa Matsumoto, Yokohama, JP;

Inventor:

Tsukasa Matsumoto, Yokohama, JP;

Assignee:

The Inctec Inc., Yokohama-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23B 3/00 (2006.01); B05D 5/06 (2006.01); B32B 1/00 (2006.01); B32B 37/02 (2006.01); C08F 26/02 (2006.01); C08F 20/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A surface shape and physical properties required for a structure having an antireflection performance of light and an improved performance of light permeability have been found, particularly the structure having surface scratch resistance is provided, a composition capable of forming the structure having such a particular structure and physical properties is provided, and further a composition which can easily form the structure which is excellent in antireflection performance of light and an improved performance of light permeability and has a large aspect ratio is provided. That is, the present invention is the structure having convex parts with an average height of 100 nm or more and 1000 nm or less or concave parts with an average depth of 100 nm or more and 1000 nm or less on its surface wherein the convex parts or the concave parts are present at an average cycle of 100 nm or more and 400 nm or less in at least one direction, characterized in that the structure is obtained by polymerizing a (meth)acrylic polymerizable composition by light irradiation, electron beam irradiation and/or heating and a storage elastic modulus at 180° C. or above is 0.5 GPa or more.


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