The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Jul. 24, 2008
Applicant:
Katsutoshi Kamei, Osaka, JP;
Inventor:
Katsutoshi Kamei, Osaka, JP;
Assignee:
Nitto Denko Corporation, Osaka, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H01B 13/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method of producing a wired circuit board includes preparing a metal supporting board, forming a metal foil on the metal supporting board, forming an insulating layer on the metal foil to expose an unneeded portion of the metal foil, etching the unneeded portion using the insulating layer as an etching resist, and forming a plurality of wires on the insulating layer.