The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2011
Filed:
Mar. 12, 2007
Takashi Uchino, Fukuoka, JP;
Tadashi Shinozaki, Fukuoka, JP;
Norifumi Eguchi, Saga, JP;
Naoki Yamauchi, Fukuoka, JP;
Masao Hidaka, Fukuoka, JP;
Toru Nakazono, Fukuoka, JP;
Takashi Uchino, Fukuoka, JP;
Tadashi Shinozaki, Fukuoka, JP;
Norifumi Eguchi, Saga, JP;
Naoki Yamauchi, Fukuoka, JP;
Masao Hidaka, Fukuoka, JP;
Toru Nakazono, Fukuoka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity. In component mount operation for taking chips of component types A, B, and C out of a component supply portion by means of a single mount head and mounting the chips on two substrates held by a first lane and a second lane, when a subsequently-carried-in subsequent substrate has come to be able to undergo component mount operation before completion of processing pertaining to a preceding substrate mount process in which component mount operation is carried out on a previously-carried-in preceding substrate among a plurality of substrates, processing pertaining to a subsequent substrate mount process is started by taking, as mount start components, chips already serving as targets of component mount operation for the preceding substrate at this timing, and processing pertaining to the preceding substrate mount process during which mounting is not yet completed is continually carried out. Thereby, the frequency of operation required with switching of a component type, such as replacement of a nozzle, can be reduced.