The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Apr. 07, 2008
Tsuyoshi Arai, Nagoya, JP;
Tadayoshi Takahara, Toyota, JP;
Yoshihito Saigo, Aichi-ken, JP;
Tatsuya Inoyama, Susono, JP;
Hiroshi Koyama, Tazimi, JP;
Tsuyoshi Arai, Nagoya, JP;
Tadayoshi Takahara, Toyota, JP;
Yoshihito Saigo, Aichi-ken, JP;
Tatsuya Inoyama, Susono, JP;
Hiroshi Koyama, Tazimi, JP;
Denso Corporation, Kariya, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Toyoda Gosei Co., Ltd., Nishikasugai, JP;
Kanto Auto Works, Ltd, Yokosuka, JP;
Toyota Boshoku Kabushiki Kaisha, Kariya, JP;
Abstract
The method of predicting the amount of deformation due to shrinkage of a molded article of the present invention finds a support point P of the bending moment M from a distribution of shrinkage rates of a molding material forming a molded articleand uses the support point P to predict the amount of deformation. At that time, it is preferable to use the support point P to find the bending moment M and to use the bending moment M to predict the amount of deformation.