Image pick-up module and method for assembly of an image pick-up module

Abstract

The invention relates to an image pick-up module, in particular for an endoscope, comprising an electronic image sensor having a plurality of contact fingers that are arranged in two rows on opposite sides and each have a length, and a circuit board, to which the contact fingers are electrically contact-connected, the circuit board having at least three sections which are connected to one another in one piece and of which a first and a second section extend in a manner spaced apart from one another essentially transversely with respect to the image sensor and a third section extends essentially parallel to the image sensor, the image sensor being arranged at the end of the first and second sections which is remote from the third section, and at least one row of the contact fingers of the image sensor running along an outer side of the first or second section. The first section, the second section and the third section are connected to one another in an unarticulated manner, the length of the first section and/or of the second section is less than or equal to the length of the contact fingers and a space is present between the first, second and third sections of the circuit board, at least one electronic component for the control electronics of the image sensor being present in the said space.