The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Feb. 25, 2009
Akihito Narita, Sakata, JP;
Naoya Sato, Sakata, JP;
Akihito Narita, Sakata, JP;
Naoya Sato, Sakata, JP;
Seiko Epson Corporation, , JP;
Abstract
A semiconductor module including: a semiconductor chip, an integrated circuit being formed in the semiconductor chip; a plurality of electrodes electrically connected to the integrated circuit; an insulating film formed on the semiconductor chip and having a plurality of openings positioned corresponding to the plurality of electrodes; and a long elastic protrusion extending on the insulating film. A plurality of interconnects respectively extend from over the electrodes to over the elastic protrusion, directions of the interconnects intersecting an axis AX that is parallel to the extending direction of the elastic protrusion. A plurality of leads are respectively in contact with the interconnects in an area positioned on the elastic protrusion. A cured adhesive maintains a space between a surface of the semiconductor chip on which the elastic protrusion is formed and a surface of the elastic substrate on which the leads are formed. A surface of the elastic protrusion except an area on which the interconnects are provided is in close contact with the elastic substrate due to an elastic force.