The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2011

Filed:

May. 13, 2008
Applicants:

Miki Ogawa, Ayase, JP;

Hirokatsu Miyata, Hadano, JP;

Albrecht Otto, Atsugi, JP;

Akira Kuriyama, Atsugi, JP;

Hiroshi Okura, Hadano, JP;

Tohru Den, Tokyo, JP;

Kazuhiko Fukutani, Santa Cruz, CA (US);

Inventors:

Miki Ogawa, Ayase, JP;

Hirokatsu Miyata, Hadano, JP;

Albrecht Otto, Atsugi, JP;

Akira Kuriyama, Atsugi, JP;

Hiroshi Okura, Hadano, JP;

Tohru Den, Tokyo, JP;

Kazuhiko Fukutani, Santa Cruz, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/461 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a dot pattern includes the steps of preparing a structured material composed of a plurality of columnar members containing a first component and a region containing a second component different from the first component surrounding the columnar members, with the structured material being formed by depositing the first component and the second component on a substrate, and removing the columnar members from the structured material to form a porous material having a columnar hole. In addition, a material is introduced into the columnar hole portions of the porous material to form a dot pattern, and the porous material is removed.


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