The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Dec. 14, 2006
Yuuji Suzuki, Tochigi-ken, JP;
Takami Moteki, Tochigi-ken, JP;
Kazuhiro Hoshino, Tochigi-ken, JP;
Satoshi Fujisawa, Tochigi-ken, JP;
Akira Kawakami, Tochigi-ken, JP;
Yuuji Suzuki, Tochigi-ken, JP;
Takami Moteki, Tochigi-ken, JP;
Kazuhiro Hoshino, Tochigi-ken, JP;
Satoshi Fujisawa, Tochigi-ken, JP;
Akira Kawakami, Tochigi-ken, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
An ultrathin copper foil with a carrier not causing blistering at a release layer interface, having a low carrier peeling force, friendly to the environment, and enabling easy peeling of a carrier foil and an ultrathin copper foil even under a high temperature environment and a printed circuit board enabling a stable production quality of a base of a printed circuit board for fine pattern applications using the ultrathin copper foil with the carrier, that is, an ultrathin copper foil with a carrier comprising a carrier foil, a release layer, and an ultrathin copper foil, wherein the release layer is formed by a metal A for retaining a release property and a metal B for facilitating plating of the ultrathin copper foil, a content a of the metal A and a content b of the metal B forming the release layer satisfying an equation:10≦/()*100≦70and a printed circuit board prepared by using such an ultrathin copper foil with a carrier.