The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Apr. 23, 2008
Applicants:
Hiroto Uchida, Osaka, JP;
Hitoshi Tsuchiya, Osaka, JP;
Tomoyuki Saito, Osaka, JP;
Hiroyuki Kato, Osaka, JP;
Inventors:
Hiroto Uchida, Osaka, JP;
Hitoshi Tsuchiya, Osaka, JP;
Tomoyuki Saito, Osaka, JP;
Hiroyuki Kato, Osaka, JP;
Assignee:
Ueno Fine Chemicals Industry, Ltd., Osaka-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 19/00 (2006.01); C09K 19/06 (2006.01); C09K 19/52 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a liquid crystalline polymer composition comprising: 100 parts by weight of a LCP, and equal to or more than 0.01 and less than 1 part by weight of a low temperature softening inorganic glass filler whose softening temperature is equal to or less than 550° C. The composition can provide a molded article which cause no or less blister formation upon reflow soldering using a lead-free solder.