The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Feb. 13, 2009
Electroplating methods and chemistries for deposition of copper-indium-gallium containing thin films
Serdar Aksu, Milpitas, CA (US);
Jiaxiong Wang, Castro Valley, CA (US);
Bulent M. Basol, Manhattan Beach, CA (US);
Serdar Aksu, Milpitas, CA (US);
Jiaxiong Wang, Castro Valley, CA (US);
Bulent M. Basol, Manhattan Beach, CA (US);
SoloPower, Inc., San Jose, CA (US);
Abstract
Described is an electrodeposition solution for deposition of a Group IB-IIIA thin film on a conductive surface. In a preferred embodiment, the electrodeposition solution comprises a solvent; a Group IB material source that dissolves in the solvent and provides a Group IB material; a Group IIIA material source that dissolves in the solvent and provides a Group IIIA material; and a blend of at least two complexing agents, one of the at least two complexing agent forming a complex with the Group IB material and the other one of the at least two complexing agent forming a complex with the Group IIIA material; wherein the pH of the solution is at least 7.