The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2011

Filed:

Feb. 13, 2009
Applicants:

Kenjiro Tanaka, Yokohama, JP;

Isamu Takeda, Yokohama, JP;

Atsushi Yoneda, Yokohama, JP;

Eriko Kimotsuki, Yokohama, JP;

Inventors:

Kenjiro Tanaka, Yokohama, JP;

Isamu Takeda, Yokohama, JP;

Atsushi Yoneda, Yokohama, JP;

Eriko Kimotsuki, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 47/06 (2006.01); B29C 47/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A manufacturing apparatus of a resin container includes a main extruder which supplies a base material resin, and a sub-extruder which supplies a sub-material. The sub-material supplied from the sub-extruder is discharged from a discharge portion provided in a die head so that the sub-material joins the base material resin continuously supplied from the main extruder. A parison is then extruded from a slit portion opened on an end side of the die head, and subjected to blow molding, thereby forming a coating layer which covers the whole or a part of a container body formed of the base material resin by using the sub-material. A suck-back mechanism which pulls back the sub-material from the discharge portion is provided between the sub-extruder and the die head, and the discharge portion is provided in the vicinity of the slit portion in-the die head.


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