The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2011
Filed:
Jan. 30, 2009
Cornel Cobianu, Bucharest, RO;
Viorel Avramescu, Bucharest, RO;
Ion Georgescu, Bucharest, RO;
Stefan-dan Costea, Bucharest, RO;
Cornel Cobianu, Bucharest, RO;
Viorel Avramescu, Bucharest, RO;
Ion Georgescu, Bucharest, RO;
Stefan-Dan Costea, Bucharest, RO;
Honeywell International Inc., Morristown, NJ (US);
Abstract
A method includes forming multiple trenches in a first wafer, forming a sensor structure on a first surface of a second wafer, and bonding the first wafer and the second wafer. The method also includes etching a second surface of the second wafer to form a sensor diaphragm in the second wafer. The method further includes removing a portion of the first wafer by cutting the first wafer in multiple areas of the first wafer associated with the trenches. A sensor includes a substrate and a surface acoustic wave (SAW) resonator on a first surface of the substrate. The sensor also includes a bonding pad electrically coupled to the SAW resonator and a notch formed in a second surface of the substrate. The sensor further includes a cover separated from the first surface of the substrate by a spacer. The SAW resonator is located between the cover and the substrate.