The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Aug. 31, 2006
Kazuhiro Urashima, Konan, JP;
Shinji Yuri, Kasugai, JP;
Manabu Sato, Nagoya, JP;
Yasuhiro Sugimoto, Konan, JP;
Kazuhiro Urashima, Konan, JP;
Shinji Yuri, Kasugai, JP;
Manabu Sato, Nagoya, JP;
Yasuhiro Sugimoto, Konan, JP;
NGK Spark Plug Co., Ltd., Aichi, JP;
Abstract
A circuit board ('″) comprising: a board core () having a main core surface () and a rear core surface (); a ceramic capacitor (″″″) having a main capacitor surface () and a rear capacitor surface (), having a structure in which a first inner electrode layer () and a second inner electrode layer () are alternately stacked with a ceramic dielectric layer () interposed therebetween, and having a plurality of capacitor function units () being electrically independent from each other, the ceramic capacitor (″″″) being buried in the board core () in a state where the main core surface () and the main capacitor surface () are directed in a same direction; and a buildup layer () having a structure in which an interlayer insulating layer () and a conductor layer () are alternately stacked on the main core surface () and the main capacitor surface () and having a semiconductor integrated circuit device mounting region () for mounting a semiconductor integrated circuit device () having a plurality of processor cores () on a surface () of the buildup layer (), wherein the plurality of capacitor function units () are capable of being electrically connected to the plurality of processor cores (), respectively.