The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Jan. 25, 2006
Akira Souma, Aomori, JP;
Yoshikazu Urushiyama, Dresden, DE;
Masahisa Tazawa, Aomori, JP;
Tomoya Sato, Aomori, JP;
Hideki Hirakawa, Aomori, JP;
Takayuki Hayashizaki, Aomori, JP;
Akira Souma, Aomori, JP;
Yoshikazu Urushiyama, Dresden, DE;
Masahisa Tazawa, Aomori, JP;
Tomoya Sato, Aomori, JP;
Hideki Hirakawa, Aomori, JP;
Takayuki Hayashizaki, Aomori, JP;
Kabushiki Kaisha Nihon Micronics, Musashino-shi, Tokyo, JP;
Abstract
A probe for current test is provided. The probe includes a probe body having a plate-like connection portion whose end face becomes a connection face to a probe board, a solder layer formed on at least one side face of said connection portion, and a guide portion formed on the connection portion. The guide portion penetrates the connection portion in its thickness direction from the one side face with the solder layer formed to the other side face. When the solder layer is melted, the guide portion guides a portion of the melted solder to the other side face.