The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7888771 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 15, 2011

Filed:

May. 02, 2007
Applicants:

Lakhbeer Singh Sidhu, Fremont, CA (US);

Srikanth Sundararajan, Dublin, CA (US);

Michael J. Hart, Palo Alto, CA (US);

Inventors:

Lakhbeer Singh Sidhu, Fremont, CA (US);

Srikanth Sundararajan, Dublin, CA (US);

Michael J. Hart, Palo Alto, CA (US);

Assignee:

Xilinx, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic fuse ('E-fuse') has a silicide filament link extending along a gap between polysilicon structures formed on a silicon substrate. The silicide filament link extends across diffusions formed in the gap. A P-N junction between terminals of the E-fuse provides high resistivity after programming (fusing) the silicide filament link.


Find Patent Forward Citations

Sidhu, Lakhbeer. (2011). E-fuse with scalable filament link (U.S. Patent No. 7888771). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7888771

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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