The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Sep. 16, 2008
Yoshiteru Miyawaki, Takatsuki, JP;
Dongxu Wang, Takatsuki, JP;
Yoshiteru Miyawaki, Takatsuki, JP;
Dongxu Wang, Takatsuki, JP;
Sanyu Rec Co., Ltd., Osaka, JP;
Abstract
A method for manufacturing an electronic device with a plurality of lead frames for individually supporting an electronic componentsurrounded by a casing, which method includes the steps of charging a resininto each casingon a substrateon which the plurality of supporting lead frames are disposed, and cutting the substrateinto individual lead frames. The step of charging the first resin includes the step of using a maskthat has through-holesin positions corresponding to regions surrounded by the casings, to charge the resininto the regions surrounded by the casings. The method is capable of improving the productivity of manufacturing electronic devices with lead frames for individually supporting an electronic component surrounded by a casing, and making the shape of the resin that covers the electronic components even.