The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Jan. 05, 2006
Takashi Niwa, Chiba, JP;
Susumu Ichihara, Chiba, JP;
Koichiro Jujo, Chiba, JP;
Hiroyuki Hoshina, Chiba, JP;
Takashi Niwa, Chiba, JP;
Susumu Ichihara, Chiba, JP;
Koichiro Jujo, Chiba, JP;
Hiroyuki Hoshina, Chiba, JP;
Seiko Instruments Inc., , JP;
Abstract
An electroforming mold has a first negative type photosensitive material formed on an electroconductive substrate, and a first through-hole extends through the firs photosensitive material to expose the electroconductive substrate. An electroconductive layer formed on an upper face of the first photosensitive material surrounds the first through-hole. A second negative type photosensitive material formed on an upper face of the electroconductive layer has a second through-hole that overlies and exposes both the first through-hole and a peripheral part of the electroconductive layer that surrounds the first through-hole. Because the electroconductive substrate and the electroconductive layer are separated from one another, the first and second through-holes precipitate an electroformed object independently during use of the electroforming mold resulting in a uniform electroformed object.