The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7886280 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 08, 2011

Filed:

Dec. 01, 2008
Applicant:

Hamzeh Zawawy, Scarborough, CA;

Inventor:

Hamzeh Zawawy, Scarborough, CA;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 9/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is disclosed a system for flattening hierarchically structured flows using a breadth-first approach. At each level of hierarchy of a hierarchically structured source flow, complex nodes are flattened by one level across the entire breadth of the flow. The results of this flattening are placed in a target flow, and any connections that existed in the source flow are re-established in the target flow in such a way that any data input into the target flow will be processed as if it had been input into the source flow. After a processing iteration, if there are still complex nodes remaining in the target flow, the target flow becomes the next source flow, and the process is repeated until the flow has been completely flattened.


Find Patent Forward Citations

Zawawy, Hamzeh. (2011). Flattening hierarchically structured flows (U.S. Patent No. 7886280). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7886280

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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