The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Apr. 09, 2009
Toshio Yano, Nakakoma-gun, JP;
Hiroshi Okamura, Kyoto, JP;
Yoshihiko Misawa, Osaka, JP;
Yoshinori Isobata, Kofu, JP;
Ken Takahashi, Nakakoma-gun, JP;
Masuo Masui, Nakakoma-gun, JP;
Eigo Sarashina, Kofu, JP;
Akira Iizuka, Nakakoma-gun, JP;
Toshio Yano, Nakakoma-gun, JP;
Hiroshi Okamura, Kyoto, JP;
Yoshihiko Misawa, Osaka, JP;
Yoshinori Isobata, Kofu, JP;
Ken Takahashi, Nakakoma-gun, JP;
Masuo Masui, Nakakoma-gun, JP;
Eigo Sarashina, Kofu, JP;
Akira Iizuka, Nakakoma-gun, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A service receiving method for receiving a component library generated from mounted component data, including component size and mounting conditions, via a communication system that includes the Internet. The method includes the service provider receiving mounted component data having mounting conditions actually realized by a fabrication of non-defective products. The method also includes the service provider deriving a component library from a mounted component database.