The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2011

Filed:

Jul. 03, 2006
Applicants:

Bedri A. Cetiner, Clearfield, KY (US);

Mark Bachman, Irvine, CA (US);

Guann-pyng LI, Irvine, CA (US);

Jiangyuan Qian, Irvine, CA (US);

Hung-pin Chang, Irvine, CA (US);

Franco DE Flaviis, Irvine, CA (US);

Inventors:

Bedri A. Cetiner, Clearfield, KY (US);

Mark Bachman, Irvine, CA (US);

Guann-Pyng Li, Irvine, CA (US);

Jiangyuan Qian, Irvine, CA (US);

Hung-Pin Chang, Irvine, CA (US);

Franco De Flaviis, Irvine, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 51/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature disposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.


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