The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Apr. 11, 2007
Johannes W. Weekamp, Beek En Donk, NL;
Cornelis Slob, Eindhoven, NL;
Jacob M. Scheer, Utrecht, NL;
Freerk E. Van Straten, Mook, NL;
Johannes W. Weekamp, Beek En Donk, NL;
Cornelis Slob, Eindhoven, NL;
Jacob M. Scheer, Utrecht, NL;
Freerk E. Van Straten, Mook, NL;
NXP B.V., Eindhoven, NL;
Abstract
The present invention relates to a method for manufacturing an electronic assembly () comprising an electronic component, a cavity and a substrate which method comprises; —providing an electronic component () having a first pattern with a substantially closed configuration; —providing a cover () on a surface of the electronic component, which cover together with said surface defines a cavity (), the closed configuration of the first pattern substantially enclosing the cover at said surface; —providing a substrate () having a second pattern with a substantially closed configuration, which closed configuration at least partially corresponds to the closed configuration of the first pattern and comprises a solder pad; —disposing solder material at the solder pad; —positioning the electronic component and the substrate so as to align both the substantially closed configurations of the first and second pattern, while the substrate supports a top surface () of the cover; —reflow-soldering the solder material, therewith providing a soldered connection () between the first and second pattern. Furthermore the present invention relates to an electronic assembly (), a cover () and a substrate ().