The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Oct. 10, 2006
Masataka Nakanishi, Kita-ku, JP;
Katsuhiko Oshimi, Kita-ku, JP;
Ryutaro Tanaka, Kita-ku, JP;
Toru Kurihashi, Kita-ku, JP;
Masataka Nakanishi, Kita-ku, JP;
Katsuhiko Oshimi, Kita-ku, JP;
Ryutaro Tanaka, Kita-ku, JP;
Toru Kurihashi, Kita-ku, JP;
Nippon Kayaku Kabushiki Kaisha, Tokyo, JP;
Abstract
To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.