The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7884031 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 08, 2011

Filed:

Jun. 15, 2009
Applicant:

Yumi Saitou, Kawasaki, JP;

Inventor:

Yumi Saitou, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01);
U.S. Cl.
CPC ...
Abstract

The semiconductor device includes an interconnect having a width of 0.1 μm or less and formed in an insulating layer constituted of a low relative dielectric constant film having a relative dielectric constant of 3.0 or lower, a via having a diameter of 0.1 μm or less and connected to the interconnect, and a dummy metal provided in the insulating layer. The dummy metal is located close to an end portion of the interconnect along an extension thereof, and the dummy metal and the interconnect are spaced by a distance of 0.3 μm or less.


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Saitou, Yumi. (2011). Semiconductor device (U.S. Patent No. 7884031). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7884031

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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