The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Jul. 12, 2006
Akihiro Ito, Toyohashi, JP;
Tadayoshi Saitou, Toyohashi, JP;
Ietsugu Santo, Toyohashi, JP;
Junichi Muramatsu, Toyohashi, JP;
Yasuo Takagi, Toyohashi, JP;
Kiharu Numata, Toyohashi, JP;
Yasuhiro Fukuhara, Toyohashi, JP;
Mina Oobayashi, Toyohashi, JP;
Akihiro Ito, Toyohashi, JP;
Tadayoshi Saitou, Toyohashi, JP;
Ietsugu Santo, Toyohashi, JP;
Junichi Muramatsu, Toyohashi, JP;
Yasuo Takagi, Toyohashi, JP;
Kiharu Numata, Toyohashi, JP;
Yasuhiro Fukuhara, Toyohashi, JP;
Mina Oobayashi, Toyohashi, JP;
Mitsubishi Rayon Co., Ltd., Tokyo, JP;
Abstract
A prepreg is provided capable of being a composite material having suitable high heat resistance, impact resistance, and mechanical properties under high temperature and high humidity conditions. As the matrix resin, a composition including a specific epoxy resin component (A), a specific bifunctional epoxy resin (B), a specific tetrafunctional epoxy resin (C), and a specific aromatic amine compound (D) at specific proportions are used. Particularly, as the epoxy resin component (A), one obtained by mixing and heating a bifunctional epoxy resin (a1), a trifunctional epoxy resin (a2), a phenol compound (a3), and a specific polyamide resin (a4) is used so as to be able to solve the above-described problems.