The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Oct. 16, 2007
Applicant:
Kenji Murao, Hitachi, JP;
Inventor:
Kenji Murao, Hitachi, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01); B32B 17/00 (2006.01); H01L 21/31 (2006.01); C29C 39/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a resinous molded article which has a fine structure of a nanometer level and includes a material containing a polymer of a polymerizable organic fluorocompound. The polymer is formed from, for example, a monomeric precursor composition containing a methacrylate and/or an acrylate in combination with a fluorine-containing photopolymerizable monomeric precursor composition miscible with the former composition.
Murao, Kenji. (2011). Fine resinous structure, fabrication thereof, and polymerizable resin-precursor composition (U.S. Patent No. 7883764). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7883764
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile