The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2011
Filed:
Jun. 08, 2004
Masashi Gotoh, Tokyo, JP;
Hajime Kuwajima, Tokyo, JP;
Hiroki Hara, Tokyo, JP;
Hiroshi Yamamoto, Tokyo, JP;
Masashi Gotoh, Tokyo, JP;
Hajime Kuwajima, Tokyo, JP;
Hiroki Hara, Tokyo, JP;
Hiroshi Yamamoto, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
The method for manufacturing an electronic part includes a step of forming an opening hole onto an insulating member sandwiched between a conductor film and a lower conductor layer, from the conductor film, a step of making a surface of the lower conductor layer adhering the insulating member as bottom of the opening hole, and making a metal plating as a conductor portion grow in the opening hole from the lower conductor layer. In the method, after metal plating has reached the conductor film, the metal plating is grown on the conductor film and the conductor portion as electrode, to thereby form a thickness enough to form an upper conductive layer.