The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 01, 2011
Filed:
Feb. 20, 2008
Cheol-gyu Hwang, Suwon-si, KR;
Sung-tae Choi, Hwaseong-si, KR;
Jung-han Choi, Hwaseong-si, KR;
Young-hwan Kim, Hwaseong-si, KR;
Dong-hyun Lee, Anyang-si, KR;
Cheol-gyu Hwang, Suwon-si, KR;
Sung-tae Choi, Hwaseong-si, KR;
Jung-han Choi, Hwaseong-si, KR;
Young-hwan Kim, Hwaseong-si, KR;
Dong-hyun Lee, Anyang-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Provided is an electromagnetic bandgap (EBG) structure, and particularly, an overlay EBG structure in which a plurality of vias and a plurality of plates are formed at intervals on a central signal line in such a manner that the vias and plates extend vertically from a substrate in order to reduce leakage loss of an electromagnetic wave through the substrate. Therefore, it is possible to prevent an electromagnetic wave passing through a transmission line from being lost through the substrate, to obtain desired frequency characteristics by adjusting the dimensions of the vias and plates, and to manufacture the overlay EBG structure using an existing CMOS process without having to perform any additional process.