The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7880485 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 01, 2011

Filed:

May. 07, 2008
Applicant:

Naoaki Nakamura, Kawasaki, JP;

Inventor:

Naoaki Nakamura, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

According to an aspect of an embodiment, a high-sensitive resistance measuring device of solder bumps comprises a resistance variation detection unit which detects a differential voltage (ΔV=V−V), which is obtained by subtracting a second voltage (V) generated in a reference bump connection unit by a constant current (I) from a second constant current source from a first voltage (V) generated in a monitored bump connection unit by the constant current I from a first constant current source, as a resistance variation voltage representing a resistance variation (ΔR) of the monitored bump connection unit.


Find Patent Forward Citations

Nakamura, Naoaki. (2011). High-sensitive resistance measuring device and monitoring method of solder bump (U.S. Patent No. 7880485). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7880485

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